Indima yeWhite Corundum Micropowder ezintweni zokupakisha ze-elekthronikhi
Ozakwethu, labo abasebenza ezintweni zokwakha kanye nokupakisha bayazi ukuthi nakuba ukupakisha nge-elekthronikhi kuzwakala kuhlaba umxhwele, empeleni kumayelana nemininingwane. Kufana nokufaka isudi yokuzivikela ku-chip eyigugu. Le suti kumele imelane nokushayisana (amandla omshini), isuse ukushisa (ukushisa), futhi inikeze ukuvikela kanye nokumelana nomswakama. Amaphutha kunoma yikuphi kwalokhu abalulekile. Namuhla, sizogxila entweni esetshenziswa kakhulu, kodwa eyinkimbinkimbi—i-white corundum micropowder—ukuze sihlole ukuthi lesi sithako esincane sidlala kanjani indima ebalulekile kule sudi yokuvikela.
Ⅰ. Ake siqale simazi umlingiswa oyinhloko: “iqhawe elimhlophe” elinobumsulwa obuphakeme.
I-corundum emhlopheKalula nje, i-aluminium oxide emsulwa kakhulu (Al₂O₃). Ihlobene ne-corundum ensundu evame kakhulu, kodwa uhlu lwayo luhlanzekile kakhulu. Ubumsulwa bayo obungavamile buyinika umbala omhlophe, ubulukhuni obuphezulu, ukumelana nokushisa okuphezulu, kanye nezakhiwo zamakhemikhali ezizinzile kakhulu, okwenza ingathinteki nhlobo yinoma yini enye.
Ukuyigaya ibe yi-micron noma ngisho ne-nanometer-scale fine powder yilokho esikubiza ngokuthii-white corundum powder. Ungawuthathi kancane lo mpuphu. Ezintweni zokupakisha ze-elekthronikhi, ikakhulukazi ama-epoxy molding compounds (EMC) noma izinto zokupakisha ze-ceramic, kungaphezu nje kwesithasiselo; kuyisithasiselo se-pillar.
II. Yini ngempela eyenzayo ephaketheni?
Cabanga ngezinto zokupakisha njengengxenye "yesimende esihlanganisiwe," lapho i-resin iyi-"glue" ethambile, enamathelayo ebamba konke ndawonye. Kodwa i-glue yodwa ayanele; ithambile kakhulu, ibuthakathaka, futhi iyaphuka uma ishiswa. Yilapho kungena khona i-white corundum powder. Kufana "namatshe" kanye "nesihlabathi" okungeziwe kusimende, okuphakamisa kakhulu ukusebenza kwale "simende" ezingeni elisha.
Ngokuyinhloko: “Isiteshi sokuhambisa ukushisa” esisebenza kahle
I-chip ifana nesithando somlilo esincane. Uma ukushisa kungenakuqedwa, kungaholela ekucindezelweni njalo nasekubambezelekeni, noma ngisho nasekushiseni ngokuphelele. I-resin ngokwayo ayisebenzi kahle ekushiseni, ibamba ukushisa ngaphakathi—isimo esingajabulisi ngempela.
I-white corundum micropowderine-conductivity ephezulu kakhulu yokushisa kune-resin. Uma inani elikhulu le-micropowder lisatshalaliswa ngokulinganayo ku-resin, lidala ngempumelelo inethiwekhi yemigwaqo emincane eminingi "yezindlela ezishisayo." Ukushisa okukhiqizwa yi-chip kuqhutshwa ngokushesha kusuka ngaphakathi kuya ebusweni bephakheji ngalezi zinhlayiya ezimhlophe ze-corundum, bese kuhlakazeka emoyeni noma kusinki yokushisa. Uma kunezelwa i-powder eningi futhi usayizi wezinhlayiya ulingana kahle, inethiwekhi yokushisa iba nkulu futhi imanzi kakhulu, futhi i-conductivity yokushisa iyonke (TC) yezinto zokupakisha iyanda. Amadivayisi aphezulu manje alwela i-conductivity ephezulu yokushisa, futhi i-white corundum micropowder idlala indima ehamba phambili kulokhu.
Ikhono Elikhethekile: "Umlawuli Wokukhulisa Ukushisa" Onembile
Lona umsebenzi obalulekile! I-chip (ngokuvamile i-silicon), izinto zokupakisha, kanye ne-substrate (njenge-PCB) konke kune-coefficients ehlukene yokwanda kokushisa (i-CTE). Kalula nje, uma kushiswa, kuyakhula futhi kunciphe ngamazinga ahlukahlukene. Uma amazinga okukhula kanye nokuncipha kwezinto zokupakisha ehluka kakhulu kunalawo e-chip, ukushintshashintsha kwezinga lokushisa, amazinga okushisa abandayo nashisayo ashintshanayo, kuzodala ukucindezeleka okukhulu kwangaphakathi. Lokhu kufana nabantu abaningana abadonsa ingubo ngezindlela ezahlukene. Ngokuhamba kwesikhathi, lokhu kungabangela ukuthi i-chip iqhekeke noma amalunga e-solder ahluleke. Lokhu kubizwa ngokuthi “ukwehluleka kwe-thermomechanical.”
Impuphu ye-corundum emhlophe ine-coefficient yokwandisa ukushisa ephansi kakhulu futhi izinzile kakhulu. Ukuyifaka ku-resin kunciphisa ngempumelelo i-coefficient yokukhulisa ukushisa yayo yonke into ehlanganisiwe, kufanelana eduze ne-silicon chip kanye ne-substrate. Lokhu kuqinisekisa ukuthi izinto ziyanda futhi zinciphe kanyekanye ngesikhathi sokushintshashintsha kwezinga lokushisa, kunciphisa kakhulu ukucindezeleka kwangaphakathi futhi kuthuthukise ngokwemvelo ukuthembeka kwedivayisi kanye nokuphila kwayo. Lokhu kufana neqembu: kuphela lapho besebenza ndawonye lapho bengakwazi ukufeza okuthile.
Amakhono Ayisisekelo: “Ukuqinisa Amathambo” Onamandla
Ngemva kokuqina, i-resin emsulwa inamandla ajwayelekile okusebenza, ubulukhuni, kanye nokumelana nokuguguleka. Ukwengeza i-corundum powder emhlophe enobulukhuni obuphezulu kanye nobukhulu obuphezulu kufana nokufaka izigidigidi “zamathambo” aqinile ngaphakathi kwe-resin ethambile. Lokhu kuletha ngqo izinzuzo ezintathu ezinkulu:
I-modulus eyandisiwe: Izinto zokwakha ziqinile kakhulu futhi aziguquguquki kakhulu, zivikela kangcono izintambo zangaphakathi ze-chip negolide.
Amandla akhuphukile: Amandla okugobeka kanye nokucindezela ayakhushulwa, okuvumela ukuthi imelane nokushaqeka kwangaphandle komshini kanye nokucindezeleka.
Ukumelana nokuguguleka nomswakama: Ubuso bephakeji buqinile futhi abugugi. Ngaphezu kwalokho, ukugcwaliswa okuxineneyo kunciphisa indlela yokungena komswakama, kuthuthukisa ukumelana nomswakama.
Ⅲ. Vele uyifake? Ukulawula ikhwalithi kubalulekile!
Kuleli qophelo, ungase ucabange ukuthi kulula—vele ufake ufulawa omningi ngangokunokwenzeka ku-resin. Nokho, yilapho ikhono langempela likhona. Uhlobo lwempuphu okufanele uyifake nokuthi ungayifaka kanjani kuyinkimbinkimbi kakhulu.
Ubumsulwa buyisisekelo: Ibanga le-elekthronikhi kanye nebanga elivamile lokuhluza kuyizinto ezimbili ezihlukene. Ikakhulukazi, okuqukethwe kokungcola kwensimbi njenge-potassium (K) kanye ne-sodium (Na) kumele kulawulwe kufinyelele emazingeni aphansi kakhulu e-ppm. Lokhu kungcola kungahamba ezindaweni zikagesi nasezindaweni ezinomswakama, kubangele ukuvuza kwesekethe noma ngisho nezifunda ezimfushane, okuwusongo olukhulu ekuthembekeni. "Okumhlophe" akuyona nje umbala; kufanekisela ubumsulwa. Usayizi wezinhlayiyana kanye nokuhlelwa kuyifomu lobuciko: Cabanga ukuthi ukube zonke izinhlayiyana bezilingana ngobukhulu, bekuyoba nezikhala phakathi kwazo ngokungenakugwenywa. Sidinga "ukulinganisa" ama-micropowders osayizi abahlukahlukene ukuze izinhlayiyana ezincane zigcwalise izikhala phakathi kwezinhlayiyana ezinkulu, kufinyelelwe ubuningi bokupakisha obuphezulu kakhulu. Ubuningi bokupakisha obuphezulu buhlinzeka ngezindlela eziningi zokuqhuba ukushisa kanye nokulawula okungcono kwe-coefficient yokwanda kokushisa. Ngesikhathi esifanayo, usayizi wezinhlayiyana akufanele ube mkhulu kakhulu, okungathinta ukugeleza kokucubungula kanye nokuphela kobuso; noma kube kuncane kakhulu, njengoba lokhu kungadala indawo enkulu yobuso futhi kuvumele ukumuncwa kwe-resin ngokweqile, kunciphise izinga lokugcwalisa kanye nokwenyuka kwezindleko. Ukuklama lokhu kusatshalaliswa kosayizi wezinhlayiyana kungenye yezimfihlo eziyinhloko zefomula ngayinye.
Ukwakheka kanye nokwelashwa kobuso kubalulekile: Ukuma kwezinhlayiya kufanele kube okuvamile, okulinganayo, kube namakhona ambalwa abukhali. Lokhu kuqinisekisa ukugeleza okuhle ku-resin futhi kunciphisa ukugxilisa ingqondo. Ukwelashwa kobuso kubaluleke kakhulu.I-corundum emhlopheithanda amanzi, kuyilapho i-resin ithanda amanzi, okwenza zingahambisani ngokwemvelo. Ngakho-ke, ubuso be-micropowder kumele bumbozwe nge-ejenti yokuhlanganisa i-silane, okwenza kube "ingubo ephilayo." Ngale ndlela, i-powder ingahlanganiswa eduze ne-resin, kugwenywe ukuthi i-interface ibe yindawo ebuthakathaka ebangela ukuqhekeka lapho ivezwa umswakama noma ukucindezeleka.